Hexagonal boron nitride is an advanced ceramic material that exhibits a flaky, microscopic morphology and features a hexagonal crystalline molecular structure. This material boasts exceptionally unique and outstanding physicochemical properties, including excellent thermal conductivity, electrical insulation, chemical corrosion resistance, and antioxidant capabilities. It can withstand temperatures up to 1000°C in air, while its performance improves further in inert gases or under vacuum conditions, allowing it to endure temperatures as high as 2000°C. After undergoing high-temperature reaction sintering at 2000°C, boron nitride maintains stable chemical and physical characteristics, with superior thermal conductivity—its single-crystal thermal conductivity reaching approximately 250–300 W/m·K. Currently, the company produces both flake-shaped crystalline powders ranging from 500 nm to 20 microns, as well as nanoscale spherical boron nitride particles.

　　Hexagonal boron nitride is highly favored in the electronics industry due to its rare combination of high thermal conductivity and excellent electrical insulation properties. Both domestic and international electronics manufacturers are conducting extensive research into its large-scale applications, including thermal conductive fillers, semiconductor packaging materials, and LED heat-dissipation encapsulants. Additionally, boron nitride has demonstrated remarkable performance in several traditional industries such as metal smelting, casting, specialty lubricants, and glass manufacturing.

　　Hexagonal boron nitride is an advanced ceramic material characterized by a hexagonal crystal structure and exhibits a flaky morphology at the microscale. This material combines exceptional thermal conductivity (with a single-crystal thermal conductivity of 250–300 W/m·K), excellent electrical insulation, chemical corrosion resistance, and superior antioxidant properties. It can withstand temperatures up to 1000°C in air, and even higher—up to 2600°C—in inert atmospheres or vacuum environments. Our company produces boron nitride products using a high-temperature reaction sintering process conducted at 1900°C, ensuring stable chemical and physical properties. Current offerings include flake-shaped crystalline powders ranging from 2 nm to 100 nm in size.

　　Thanks to its unique thermal conductivity and insulation properties, hexagonal boron nitride is widely used in the electronics industry—for applications such as thermal conductive fillers, semiconductor packaging, and LED heat dissipation. Meanwhile, it also demonstrates exceptional performance in traditional industries like metal smelting, casting, specialty lubricants, and glass manufacturing.

Model	Purity %	Granularity	Boron oxide %	Total Oxygen %	Carbon %	Specific Surface Area (㎡/g)
F-BN100	>98.5	2–75 μm	<0.8	<1.0	<0.12	2-32
F-BN200	>99.0	2–75 μm	<0.4	<0.7	<0.1	2-32
F-BN300	>99.3	2–75 μm	<0.2	<0.25	<0.05	2-32
F-BN400	>99.6	2–75 μm	<0.08	<0.18	<0.03	2-32

Hexagonal boron nitride boasts exceptionally unique and outstanding physical and chemical properties, including excellent thermal conductivity, electrical insulation, chemical corrosion resistance, and antioxidant capabilities. It can withstand temperatures up to 1000°C in air, and even higher—up to 2000°C—in inert gases or under vacuum conditions.